Conventional Printed Circuit Board Market

Report Code - SE20241027B | Industry - Semiconductor & Electronics | Published on - October, 2024 | Pages - 174 | Format -

Conventional Printed Circuit Board Market by Product Type, Application and Region - Global Market Analysis and Forecast (2019 - 2030)




Conventional Printed Circuit Boards (PCBs) are foundational components in modern electronics, serving as the backbone for electrical interconnectivity. These boards are composed of layers of conductive material and insulating substrates, meticulously designed to support and connect electronic components. With applications spanning industries such as consumer electronics, automotive, healthcare, and telecommunications, conventional PCBs play a critical role in the global electronics ecosystem.

Increasing Demand for Electronic Devices

The global surge in the consumption of electronic devices is one of the most significant drivers of the PCB market. From smartphones to laptops and wearable technology, electronic devices have become indispensable in daily life. Each of these devices relies on compact, reliable, and efficient PCBs to facilitate operations, including power management, connectivity, and data processing. Additionally, the rise of smart home ecosystems has further fueled this demand. Devices such as smart speakers, thermostats, and home security systems all depend on robust PCBs to ensure seamless functionality. Moreover, advancements in medical technology have led to an increase in healthcare electronics, including portable diagnostic tools and patient monitoring systems, further strengthening the demand for PCBs.

Advancements in PCB Technology

Technological innovation in PCB design and manufacturing has significantly expanded the range of applications and functionalities these boards can support. Multilayer PCBs, which feature multiple layers of conductive materials, enable the integration of complex circuitry into compact spaces, making them ideal for modern gadgets like smartphones and tablets. Similarly, flexible and rigid-flex PCBs have gained popularity for their ability to bend and adapt to non-traditional form factors, which is crucial for foldable devices and wearables. High-Density Interconnect (HDI) PCBs, another groundbreaking development, offer a higher density of connections per unit area, catering to the demand for miniaturized and high-performance electronic devices. These advancements not only enhance the capabilities of PCBs but also open doors to new applications in industries such as automotive and aerospace.

Growing Adoption of IoT and Smart Devices

The Internet of Things (IoT) has revolutionized how devices communicate and interact, creating a robust demand for PCBs tailored to connected technologies. IoT devices, ranging from smart refrigerators to industrial sensors, require specially designed PCBs capable of managing low power consumption and ensuring reliable connectivity. In urban settings, smart city initiatives, including intelligent transportation systems and energy-efficient street lighting, have further increased the need for advanced PCB solutions. Industrial IoT (IIoT) applications, such as connected machinery and asset tracking systems, have also emerged as significant growth areas. Similarly, wearable devices like fitness trackers and augmented reality headsets rely on compact and efficient PCBs for their lightweight and user-friendly designs.

Rising Demand in Automotive Electronics

The automotive sector is rapidly becoming one of the most prominent drivers of PCB demand. The shift toward electric vehicles (EVs) has introduced a need for high-performance PCBs in areas such as battery management systems, power distribution, and charging infrastructure. Furthermore, advancements in Advanced Driver-Assistance Systems (ADAS) and the development of autonomous vehicles have increased the complexity and quantity of electronic components required in modern automobiles. Systems like collision avoidance, lane-keeping assistance, and adaptive cruise control rely heavily on PCBs for sensor integration and real-time data processing. Additionally, infotainment systems, digital dashboards, and connectivity features in vehicles further amplify the need for reliable and efficient PCBs.

The growth of the conventional PCB market faces significant challenges stemming primarily from supply chain disruptions and rising raw material costs. Geopolitical tensions, global trade restrictions, and unexpected events such as pandemics have disrupted the availability of essential materials like copper and laminates, critical components in PCB manufacturing. These disruptions lead to delays, increased costs, and reduced operational efficiency for manufacturers. Additionally, the rising costs of raw materials further strain production budgets, compelling manufacturers to either absorb the costs or pass them on to customers, potentially impacting market demand. Together, these factors create a volatile market environment, challenging manufacturers and suppliers to maintain consistent production and competitive pricing amidst external pressures.

The conventional PCB market presents significant opportunities, particularly in emerging markets and through advancements in miniaturization and high-density technologies. Developing economies in regions like Asia-Pacific, Latin America, and Africa are undergoing rapid industrialization and digital transformation, creating a growing demand for electronics and, consequently, PCBs. Additionally, the trend toward miniaturization in consumer electronics and industrial applications has spurred innovation in High-Density Interconnect (HDI) and flexible PCB technologies, enabling more compact, efficient, and high-performance devices. These advancements not only expand the application scope of PCBs but also open avenues for manufacturers to cater to the rising demand for innovative solutions in fields such as IoT, 5G, and automotive electronics.

Regional Market Analysis

Asia-Pacific is the dominant region in the conventional PCB market, driven by its advanced manufacturing capabilities and large-scale production. Countries like China, Japan, South Korea, and Taiwan are home to some of the world’s largest PCB manufacturers, benefiting from efficient and cost-effective production processes that cater to both domestic and global demand. The region hosts major electronics giants such as Samsung, Huawei, and Foxconn, which rely heavily on PCBs for a wide array of devices, including smartphones and consumer electronics. The region's cost-effective manufacturing—thanks to affordable labor and raw materials, particularly in China and India—enables the production of high volumes of PCBs at competitive prices. Additionally, the expansion of emerging markets in countries like India, Vietnam, and Indonesia, driven by growing middle-class populations and rising disposable incomes, is further fueling the demand for consumer electronics and, consequently, for PCBs in the region.

Market Segmentation

Based on Product Type:

  • Double Layer Board
  • Multilayer Board

Based on Application:

  • Communication
  • Electrical
  • Electronic
  • Other

Key Players:

  • Nippon Mektron
  • MEIKO
  • Compeq
  • TTM Technologies
  • AT&S
  • Unimicron
  • Kinwong
  • SHENGYI ELECTRONICS
  • DSBJ (Multek?
  • Shennan Circuits Company
  • WUS Printed Circuit
  1. Introduction
    1. Study Goal & Objective
    2. Scope of Report
    3. Research Methodology
    4. Assumptions & Abbreviations
  2. Market Overview
    1. Global Conventional Printed Circuit Board Market Introduction
      1. Global Conventional Printed Circuit Board Market Size (US$ Million), 2019 – 2030
      2. Global Conventional Printed Circuit Board Market Opportunity Analysis Size, US$ Million (2020 – 2030)
      3. Top Emerging Countries
      4. Top Dominating Countries
    2. Macro- Economic Factor
      1. Top Countries GDP Analysis
      2. Impact of Covid-19 on Global Conventional Printed Circuit Board Market
    3. Market Determinants
      1. Market Driver
      2. Market Restraints
      3. Market Opportunities
    4. Value Chain Analysis
    5. Technology/Product Roadmap
    6. Porters 5 Force Model
    7. PEST Analysis
    8. Market Growth Opportunity Analysis
      1. By Region
      2. By Segment
  3. Market Segmentation
    1. Global Conventional Printed Circuit Board Market Analysis, By Product Type
      1. Segment Analysis
      2. Segment Share Analysis (%), 2022 & 2030
      3. Market Size & Forecast (US$ Million), By Product Type, 2019 – 2030
        1. Double Layer Board
        2. Multilayer Board
    2. Global Conventional Printed Circuit Board Market Analysis, By Application
      1. Segment Analysis
      2. Segment Share Analysis (%), 2022 & 2030
      3. Market Size & Forecast (US$ Million), By Application, 2019 – 2030
        1. Communication
        2. Electrical
        3. Electronic
        4. Other
  4. Regional Analysis
    1. Regional Dashboard
    2. Regional Analysis
    3. Market Analysis and Forecast, by Region, US$ Million (2019 – 2030)
    4. North America Conventional Printed Circuit Board Market Analysis
      1. Market Size & Forecast, US$ Million (2019 – 2030)
      2. Market Growth Opportunity Analysis, US$ Million (2021 - 2030)
      3. Market Share Analysis, By Country (%), 2022 & 2030
      4. Market Size & Forecast (US$ Million), By Country, 2019 – 2030
        1. United States
        2. Canada
      5. Market Size & Forecast (US$ Million), By Product Type, 2019 – 2030
        1. Double Layer Board
        2. Multilayer Board
      6. Market Size & Forecast (US$ Million), By Application, 2019 – 2030
        1. Communication
        2. Electrical
        3. Electronic
        4. Other
    5. Europe Conventional Printed Circuit Board Market Analysis
      1. Market Size & Forecast, US$ Million (2019 – 2030)
      2. Market Growth Opportunity Analysis, US$ Million (2021 - 2030)
      3. Market Share Analysis, By Country (%), 2022 & 2030
      4. Market Size & Forecast (US$ Million), By Country, 2019 – 2030
        1. Germany
        2. United Kingdom
        3. France
        4. Italy
        5. Spain
        6. Russia
        7. Rest of Europe
      5. Market Size & Forecast (US$ Million), By Product Type, 2019 – 2030
        1. Double Layer Board
        2. Multilayer Board
      6. Market Size & Forecast (US$ Million), By Application, 2019 – 2030
        1. Communication
        2. Electrical
        3. Electronic
        4. Other
    6. Asia Pacific Conventional Printed Circuit Board Market Analysis
      1. Market Size & Forecast, US$ Million (2019 – 2030)
      2. Market Growth Opportunity Analysis, US$ Million (2021 - 2030)
      3. Market Share Analysis, By Country (%), 2022 & 2030
      4. Market Size & Forecast (US$ Million), By Country, 2019 – 2030
        1. China
        2. Japan
        3. India
        4. South Korea
        5. Australia & New Zealand
        6. ASEAN Countries
        7. Rest of Asia Pacific
      5. Market Size & Forecast (US$ Million), By Product Type, 2019 – 2030
        1. Double Layer Board
        2. Multilayer Board
      6. Market Size & Forecast (US$ Million), By Application, 2019 – 2030
        1. Communication
        2. Electrical
        3. Electronic
        4. Other
    7. Middle East & Africa Conventional Printed Circuit Board Market Analysis
      1. Market Size & Forecast, US$ Million (2019 – 2030)
      2. Market Growth Opportunity Analysis, US$ Million (2021 - 2030)
      3. Market Share Analysis, By Country (%), 2022 & 2030
      4. Market Size & Forecast (US$ Million), By Country, 2019 – 2030
        1. GCC
        2. South Africa
        3. Rest of Middle East & Africa
      5. Market Size & Forecast (US$ Million), By Product Type, 2019 – 2030
        1. Double Layer Board
        2. Multilayer Board
      6. Market Size & Forecast (US$ Million), By Application, 2019 – 2030
        1. Communication
        2. Electrical
        3. Electronic
        4. Other
    8. Latin America Conventional Printed Circuit Board Market Analysis
      1. Market Size & Forecast, US$ Million (2019 – 2030)
      2. Market Growth Opportunity Analysis, US$ Million (2021 - 2030)
      3. Market Share Analysis, By Country (%), 2022 & 2030
      4. Market Size & Forecast (US$ Million), By Country, 2019 – 2030
        1. Brazil
        2. Mexico
        3. Argentina
        4. Rest of Latin America
      5. Market Size & Forecast (US$ Million), By Product Type, 2019 – 2030
        1. Double Layer Board
        2. Multilayer Board
      6. Market Size & Forecast (US$ Million), By Application, 2019 – 2030
        1. Communication
        2. Electrical
        3. Electronic
        4. Other
  5. Competitive Analysis
    1. Company Share Analysis (%) 2023
    2. List of Acquisition, Merger, Collaboration & New Product Launch
  6. Company Profiles (Company Overview, Financial Analysis, Product Offerings, Market Strategies)
    1. Nippon Mektron
    2. MEIKO
    3. Compeq
    4. TTM Technologies
    5. AT&S
    6. Unimicron
    7. Kinwong
    8. SHENGYI ELECTRONICS
    9. DSBJ (Multek?
    10. Shennan Circuits Company
    11. WUS Printed Circuit

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